CN1F8KTTDD221J
vs
TSN3ATJ221
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
KOA SPEER ELECTRONICS INC
TATEYAMA KAGAKU GROUP
Package Description
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Element Power Dissipation
0.063 W
First Element Resistance
220 Ω
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Network Type
ISOLATED
ISOLATED
Number of Elements
1
Number of Functions
8
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
TR, PAPER, 10 INCH
Bulk
Rated Power Dissipation (P)
0.25 W
0.063 W
Rated Temperature
70 °C
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Size Code
0615
1506
Surface Mount
YES
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
1
2
Construction
Chip
Package Height
0.45 mm
Package Length
3.8 mm
Package Width
1.6 mm
Resistance
220 Ω
Technology
METAL GLAZE/THICK FILM
Compare CN1F8KTTDD221J with alternatives
Compare TSN3ATJ221 with alternatives