CMX868P4
vs
CMX868E2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CML MICROCIRCUITS LTD
|
MX COM INC
|
| Part Package Code |
DIP
|
TSSOP
|
| Package Description |
DIP, DIP24,.6
|
TSSOP-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
2 Mbps
|
2 Mbps
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDSO-G24
|
| Length |
31.37 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP24,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.59 mm
|
|
| Supply Current-Max |
11 mA
|
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Telecom IC Type |
MODEM
|
MODEM
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CMX868P4 with alternatives
Compare CMX868E2 with alternatives