CMP08052K260.1%10PPM/KNP10
vs
P0805Y2261WBW
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROTECH GMBH ELECTRONIC
|
VISHAY INTERTECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e3
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
2 mm
|
1.91 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.25 mm
|
1.27 mm
|
| Packing Method |
Tape
|
WAFFLE PACK
|
| Rated Power Dissipation (P) |
0.2 W
|
0.2 W
|
| Resistance |
2260 Ω
|
2260 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Series |
CMP
|
|
| Size Code |
0805
|
0805
|
| Technology |
THIN FILM
|
THIN FILM
|
| Temperature Coefficient |
10 ppm/°C
|
10 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
TIN LEAD SILVER OVER NICKEL
|
| Tolerance |
0.1%
|
0.05%
|
| Working Voltage |
150 V
|
150 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
CHIP
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8533.21.00.30
|
| Factory Lead Time |
|
27 Weeks
|
| Additional Feature |
|
ANTI-SULFUR, HIGH PRECISION
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare CMP08052K260.1%10PPM/KNP10 with alternatives
Compare P0805Y2261WBW with alternatives