CM3P-67201AL-20SHXXX:D
vs
IM1P-67201AL-20
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
TEMIC SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
20 ns
|
20 ns
|
| Cycle Time |
30 ns
|
30 ns
|
| JESD-30 Code |
R-PDIP-T28
|
R-GDIP-T28
|
| Memory Density |
4608 bit
|
4608 bit
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
512X9
|
512X9
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Package Description |
|
0.300 INCH, CERAMIC, DIP-28
|
| Clock Frequency-Max (fCLK) |
|
33.33 MHz
|
| JESD-609 Code |
|
e0
|
| Memory IC Type |
|
OTHER FIFO
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP28,.3
|
| Supply Current-Max |
|
0.15 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|