CLL4764ABK
vs
MSP1N3044CUR-1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
MICROSEMI CORP
Package Description
O-LELF-R2
O-LELF-R2
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
350 Ω
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Knee Impedance-Max
3000 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1.25 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
100 V
100 V
Reverse Current-Max
5 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
2%
Working Test Current
2.5 mA
2.5 mA
Base Number Matches
2
4
Part Package Code
DO-213AB
Pin Count
2
Additional Feature
METALLURGICALLY BONDED, HIGH RELIABILITY
JEDEC-95 Code
DO-213AB
Compare CLL4764ABK with alternatives
Compare MSP1N3044CUR-1 with alternatives