CLC5633IM vs CLC5633IMX feature comparison

CLC5633IM National Semiconductor Corporation

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CLC5633IMX National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type BUFFER BUFFER
Average Bias Current-Max (IIB) 24 µA 24 µA
Bandwidth (3dB)-Nom 97 MHz 97 MHz
Bias Current-Max (IIB) @25C 18 µA 18 µA
Input Offset Voltage-Max 35000 µV 35000 µV
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e0
Length 8.65 mm 8.65 mm
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 3 3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Current-Min 0.04 A 0.04 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Slew Rate-Min 140 V/us 140 V/us
Slew Rate-Nom 290 V/us 290 V/us
Supply Current-Max 12 mA 12 mA
Supply Voltage Limit-Max 14 V 14 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 2 1

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