CLC114MDC
vs
CLC109AMC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
WAFER
WAFER
Package Description
DIE,
DIE,
Pin Count
11
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
BUFFER
BUFFER
Average Bias Current-Max (IIB)
5 µA
4 µA
Bandwidth (3dB)-Nom
200 MHz
270 MHz
Input Offset Voltage-Max
8000 µV
5000 µV
JESD-30 Code
R-XUUC-N11
X-XUUC-N4
Neg Supply Voltage Limit-Max
-7 V
-7 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Number of Functions
1
1
Number of Terminals
11
4
Output Current-Min
0.02 A
0.04 A
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Equivalence Code
DIE OR CHIP
DIE OR CHIP
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Slew Rate-Nom
450 V/us
350 V/us
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Base Number Matches
1
1
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Slew Rate-Min
250 V/us
Supply Current-Max
4 mA
Technology
BIPOLAR
Temperature Grade
MILITARY
Compare CLC114MDC with alternatives
Compare CLC109AMC with alternatives