CLC114AE-QML
vs
BUF634UE4
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
QCCN, LCC20,.35SQ
|
SOP, SOP8,.25
|
| Pin Count |
20
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Bandwidth (3dB)-Nom |
200 MHz
|
180 MHz
|
| Bias Current-Max (IIB) @25C |
5 µA
|
20 µA
|
| Input Offset Voltage-Max |
8200 µV
|
100000 µV
|
| JESD-30 Code |
S-CQCC-N20
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
8.89 mm
|
4.9 mm
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-15 V
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
20
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Current-Min |
0.025 A
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
SOP
|
| Package Equivalence Code |
LCC20,.35SQ
|
SOP8,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
1.91 mm
|
1.75 mm
|
| Slew Rate-Min |
180 V/us
|
|
| Slew Rate-Nom |
450 V/us
|
2000 V/us
|
| Supply Current-Max |
17 mA
|
20 mA
|
| Supply Voltage Limit-Max |
7 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.89 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Average Bias Current-Max (IIB) |
|
20 µA
|
| Moisture Sensitivity Level |
|
3
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare CLC114AE-QML with alternatives
Compare BUF634UE4 with alternatives