CLC111AMC vs BUF634PG4 feature comparison

CLC111AMC Texas Instruments

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BUF634PG4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Package Description DIE, DIE OR CHIP DIP-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type BUFFER BUFFER
Average Bias Current-Max (IIB) 15 µA 20 µA
Bandwidth (3dB)-Nom 450 MHz 180 MHz
Bias Current-Max (IIB) @25C 15 µA 20 µA
Input Offset Voltage-Max 9000 µV 100000 µV
JESD-30 Code X-XUUC-N R-PDIP-T8
Neg Supply Voltage Limit-Max -7 V -18 V
Neg Supply Voltage-Nom (Vsup) -5 V -15 V
Number of Functions 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Current-Min 0.05 A
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP DIP8,.3
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Slew Rate-Min 2700 V/us
Slew Rate-Nom 3500 V/us 2000 V/us
Supply Current-Max 12 mA 20 mA
Supply Voltage Limit-Max 7 V 18 V
Supply Voltage-Nom (Vsup) 5 V 15 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 8
Samacsys Manufacturer Texas Instruments
JESD-609 Code e4
Length 9.81 mm
Number of Terminals 8
Packing Method TUBE
Seated Height-Max 5.08 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare CLC111AMC with alternatives

Compare BUF634PG4 with alternatives