CLC111ALC
vs
LMH6560MTX/NOPB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
WAFER
TSSOP
Package Description
DIE, DIE OR CHIP
TSSOP, TSSOP14,.25
Pin Count
4
14
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
BUFFER
BUFFER
Average Bias Current-Max (IIB)
15 µA
14 µA
Bandwidth (3dB)-Nom
800 MHz
280 MHz
Bias Current-Max (IIB) @25C
15 µA
Input Offset Voltage-Max
9000 µV
25000 µV
JESD-30 Code
R-XUUC-N4
R-PDSO-G14
Neg Supply Voltage Limit-Max
-7 V
-6.5 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Number of Functions
1
1
Number of Terminals
4
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Current-Min
0.05 A
0.05 A
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
TSSOP
Package Equivalence Code
DIE OR CHIP
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Slew Rate-Min
2700 V/us
Slew Rate-Nom
3500 V/us
3100 V/us
Supply Current-Max
12 mA
63 mA
Supply Voltage Limit-Max
7 V
6.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
JESD-609 Code
e3
Length
5 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.1 mm
Terminal Finish
Matte Tin (Sn)
Terminal Pitch
0.65 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
4.4 mm
Compare CLC111ALC with alternatives
Compare LMH6560MTX/NOPB with alternatives