CLC111AIB
vs
CLC109ALC
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
COMLINEAR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP, DIP8,.3
DIE,
Reach Compliance Code
unknown
unknown
Amplifier Type
BUFFER
BUFFER
Average Bias Current-Max (IIB)
15 µA
4 µA
Bandwidth (3dB)-Nom
800 MHz
270 MHz
Bias Current-Max (IIB) @25C
15 µA
Input Offset Voltage-Max
9000 µV
5000 µV
JESD-30 Code
R-GDIP-T8
X-XUUC-N4
JESD-609 Code
e0
Neg Supply Voltage Limit-Max
-7 V
-7 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Number of Functions
1
1
Number of Terminals
8
4
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Current-Min
0.05 A
0.04 A
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DIP
DIE
Package Equivalence Code
DIP8,.3
DIE OR CHIP
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
IN-LINE
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Slew Rate-Min
2700 V/us
250 V/us
Slew Rate-Nom
3500 V/us
350 V/us
Supply Current-Max
12 mA
4 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Base Number Matches
2
3
Part Package Code
WAFER
Pin Count
4
ECCN Code
EAR99
HTS Code
8542.33.00.01
Compare CLC111AIB with alternatives
Compare CLC109ALC with alternatives