CLC111A8B vs LMH6560MA/NOPB feature comparison

CLC111A8B National Semiconductor Corporation

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LMH6560MA/NOPB Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP SOIC
Package Description DIP, DIP8,.3 SOP, SOP14,.25
Pin Count 8 14
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type BUFFER BUFFER
Average Bias Current-Max (IIB) 15 µA 14 µA
Bandwidth (3dB)-Nom 800 MHz 280 MHz
Bias Current-Max (IIB) @25C 15 µA 14 µA
Input Offset Voltage-Max 9000 µV 25000 µV
JESD-30 Code R-GDIP-T8 R-PDSO-G14
JESD-609 Code e0 e3
Neg Supply Voltage Limit-Max -7 V -6.5 V
Neg Supply Voltage-Nom (Vsup) -5 V -5 V
Number of Functions 1 1
Number of Terminals 8 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Current-Min 0.05 A 0.05 A
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 1.753 mm
Slew Rate-Min 2700 V/us
Slew Rate-Nom 3500 V/us 3100 V/us
Supply Current-Max 12 mA 63 mA
Supply Voltage Limit-Max 7 V 6.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.899 mm
Base Number Matches 1 1
Pbfree Code Yes
Length 8.6235 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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