CLC111A8B vs BUF634UE4 feature comparison

CLC111A8B National Semiconductor Corporation

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BUF634UE4 Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, DIP8,.3 SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type BUFFER BUFFER
Average Bias Current-Max (IIB) 15 µA 20 µA
Bandwidth (3dB)-Nom 800 MHz 180 MHz
Bias Current-Max (IIB) @25C 15 µA 20 µA
Input Offset Voltage-Max 9000 µV 100000 µV
JESD-30 Code R-GDIP-T8 R-PDSO-G8
JESD-609 Code e0 e4
Neg Supply Voltage Limit-Max -7 V -18 V
Neg Supply Voltage-Nom (Vsup) -5 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Current-Min 0.05 A
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 1.75 mm
Slew Rate-Min 2700 V/us
Slew Rate-Nom 3500 V/us 2000 V/us
Supply Current-Max 12 mA 20 mA
Supply Voltage Limit-Max 7 V 18 V
Supply Voltage-Nom (Vsup) 5 V 15 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Samacsys Manufacturer Texas Instruments
Length 4.9 mm
Moisture Sensitivity Level 3
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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