CLC110A8D vs CLC111ALC feature comparison

CLC110A8D National Semiconductor Corporation

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CLC111ALC National Semiconductor Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP WAFER
Package Description DIP, DIP8,.3 DIE, DIE OR CHIP
Pin Count 8 4
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
kg CO2e/kg 12.3 12.3
Average Weight (mg) 569.675 0.6
CO2e (mg) 7007.002 7.38
Category CO2 Kg 12.3 12.3
Compliance Temperature Grade Military: -55C to +125C Industrial: -40C to +85C
Amplifier Type BUFFER BUFFER
Average Bias Current-Max (IIB) 50 µA 15 µA
Bandwidth (3dB)-Nom 90 MHz 800 MHz
Bias Current-Max (IIB) @25C 50 µA 15 µA
Input Offset Voltage-Max 8000 µV 9000 µV
JESD-30 Code R-GDIP-T8 R-XUUC-N4
JESD-609 Code e0
Length 10.045 mm
Neg Supply Voltage Limit-Max -7 V -7 V
Neg Supply Voltage-Nom (Vsup) -5 V -5 V
Number of Functions 1 1
Number of Terminals 8 4
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Current-Min 0.05 A 0.05 A
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP8,.3 DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Slew Rate-Min 500 V/us 2700 V/us
Slew Rate-Nom 800 V/us 3500 V/us
Supply Current-Max 20 mA 12 mA
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 7.62 mm
Base Number Matches 3 2

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