CL31B225KBHVPNC vs MMJCU31LAB7225KTPA18 feature comparison

CL31B225KBHVPNC Samsung Electro-Mechanics

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MMJCU31LAB7225KTPA18 TAIYO YUDEN

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer SAMSUNG ELECTRO-MECHANICS TAIYO YUDEN CO LTD
Package Description , 1206 CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Capacitance 2.2 µF 2.2 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.6 mm 1.6 mm
JESD-609 Code e3
Length 3.2 mm 3.2 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Style SMT SMT
Packing Method TR, CARDBOARD, 7 INCH TR, EMBOSSED, 7 INCH
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 50 V 50 V
Reference Standard AEC-Q200
Size Code 1206 1206
Surface Mount YES YES
Temperature Characteristics Code X7R X7R
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Width 1.6 mm 1.6 mm
Base Number Matches 1 1
Package Shape RECTANGULAR PACKAGE

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