CL31B225KBHVPNC
vs
MMJCU31LAB7225KTPA18
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
SAMSUNG ELECTRO-MECHANICS
TAIYO YUDEN CO LTD
Package Description
, 1206
CHIP
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Capacitance
2.2 µF
2.2 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
1.6 mm
1.6 mm
JESD-609 Code
e3
Length
3.2 mm
3.2 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
10%
10%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Style
SMT
SMT
Packing Method
TR, CARDBOARD, 7 INCH
TR, EMBOSSED, 7 INCH
Positive Tolerance
10%
10%
Rated (DC) Voltage (URdc)
50 V
50 V
Reference Standard
AEC-Q200
Size Code
1206
1206
Surface Mount
YES
YES
Temperature Characteristics Code
X7R
X7R
Temperature Coefficient
15% ppm/°C
15% ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
1.6 mm
1.6 mm
Base Number Matches
1
1
Package Shape
RECTANGULAR PACKAGE
Compare CL31B225KBHVPNC with alternatives
Compare MMJCU31LAB7225KTPA18 with alternatives