CL31B225KBHSNNS
vs
MMJCU31LAB7225KTPA18
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SAMSUNG ELECTRO-MECHANICS
|
TAIYO YUDEN CO LTD
|
| Package Description |
, 1206
|
CHIP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Capacitance |
2.2 µF
|
2.2 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
1.6 mm
|
1.6 mm
|
| JESD-609 Code |
e3
|
|
| Length |
3.2 mm
|
3.2 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
10%
|
10%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
Tape, Plastic
|
TR, EMBOSSED, 7 INCH
|
| Positive Tolerance |
10%
|
10%
|
| Rated (DC) Voltage (URdc) |
50 V
|
50 V
|
| Size Code |
1206
|
1206
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
X7R
|
X7R
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Width |
1.6 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8532.24.00.20
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
|
|
|
Compare CL31B225KBHSNNS with alternatives
Compare MMJCU31LAB7225KTPA18 with alternatives