CL31B106KLHNNNE vs MMJCG31LBB7106KTPA18 feature comparison

CL31B106KLHNNNE Samsung Electro-Mechanics

Buy Now Datasheet

MMJCG31LBB7106KTPA18 TAIYO YUDEN

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer SAMSUNG ELECTRO-MECHANICS TAIYO YUDEN CO LTD
Part Package Code 1206
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Factory Lead Time 20 Weeks
Capacitance 10 µF 10 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.6 mm 1.6 mm
JESD-609 Code e3
Length 3.2 mm 3.2 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, EMBOSSED PLASTIC, 7 INCH TR, EMBOSSED, 7 INCH
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 35 V 35 V
Size Code 1206 1206
Surface Mount YES YES
Temperature Characteristics Code X7R X7R
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Width 1.6 mm 1.6 mm
Base Number Matches 1 1

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Compare MMJCG31LBB7106KTPA18 with alternatives