CL31B106KAHNNNE vs GMC31X7R106K25NTDLF feature comparison

CL31B106KAHNNNE Samsung Electro-Mechanics

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GMC31X7R106K25NTDLF Cal-Chip Electronics

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer SAMSUNG ELECTRO-MECHANICS CAL-CHIP ELECTRONICS INC
Part Package Code 1206
Package Description CHIP , 1206
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20
Factory Lead Time 20 Weeks
Samacsys Manufacturer SAMSUNG
Capacitance 10 µF 10 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.8 mm 1.8 mm
JESD-609 Code e3 e3
Length 3.2 mm 3.2 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, EMBOSSED PLASTIC, 7 INCH TR, 13 Inch
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 25 V 25 V
Size Code 1206 1206
Surface Mount YES YES
Temperature Characteristics Code X7R X7R
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish MATTE TIN OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Width 1.6 mm 1.6 mm
Base Number Matches 1 1

Compare CL31B106KAHNNNE with alternatives

Compare GMC31X7R106K25NTDLF with alternatives