CL10C470FB8NNNE
vs
GRM1885C1H470FD01D
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MURATA MANUFACTURING CO LTD
|
Package Description |
, 0603
|
, 0603
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Capacitance |
0.000047 µF
|
0.000047 µF
|
Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
Dielectric Material |
CERAMIC
|
CERAMIC
|
Height |
0.8 mm
|
0.8 mm
|
JESD-609 Code |
e3
|
|
Length |
1.6 mm
|
1.6 mm
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Multilayer |
Yes
|
Yes
|
Negative Tolerance |
1%
|
1%
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Style |
SMT
|
SMT
|
Packing Method |
Tape, Embossed
|
TR, PAPER, 7 INCH
|
Positive Tolerance |
1%
|
1%
|
Rated (DC) Voltage (URdc) |
50 V
|
50 V
|
Size Code |
0603
|
0603
|
Surface Mount |
YES
|
YES
|
Temperature Characteristics Code |
C0G
|
C0G
|
Temperature Coefficient |
30ppm/Cel ppm/°C
|
30ppm/Cel ppm/°C
|
Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Width |
0.8 mm
|
0.8 mm
|
Base Number Matches |
2
|
1
|
HTS Code |
|
8532.24.00.20
|
Package Shape |
|
RECTANGULAR PACKAGE
|
|
|
|
Compare CL10C470FB8NNNE with alternatives
Compare GRM1885C1H470FD01D with alternatives