CJD112 vs MJD112-T1 feature comparison

CJD112 Central Semiconductor Corp

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MJD112-T1 Samsung Semiconductor

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CENTRAL SEMICONDUCTOR CORP SAMSUNG SEMICONDUCTOR INC
Package Description DPAK-3 SMALL OUTLINE, R-PSSO-G2
Pin Count 3 3
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95 8541.29.00.95
Case Connection COLLECTOR
Collector Current-Max (IC) 2 A 2 A
Collector-Emitter Voltage-Max 100 V 100 V
Configuration DARLINGTON DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 200 200
JESD-30 Code R-PSSO-G2 R-PSSO-G2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 20 W 20 W
Power Dissipation-Max (Abs) 20 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 25 MHz 25 MHz
VCEsat-Max 2 V 3 V
Base Number Matches 9 1
Collector-Base Capacitance-Max 100 pF

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