CIH05T8N2JNC
vs
CIH05T8N2JAC
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
SAMSUNG ELECTRO-MECHANICS
|
SAMSUNG SEMICONDUCTOR INC
|
Package Description |
0402
|
0402
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8504.50.80.00
|
|
Case/Size Code |
0402
|
0402
|
Construction |
Rectangular
|
Chip
|
Core Material |
CERAMIC
|
Ceramic
|
DC Resistance |
0.37 Ω
|
0.37 Ω
|
Inductance-Nom (L) |
0.0082 µH
|
0.0082 µH
|
Inductor Application |
RF INDUCTOR
|
|
Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
JESD-609 Code |
e3
|
e3
|
Number of Functions |
1
|
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.5 mm
|
0.5 mm
|
Package Length |
1 mm
|
1 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
0.5 mm
|
0.5 mm
|
Packing Method |
Tape, Paper
|
Tape, Paper
|
Quality Factor-Min (at L-nom) |
8
|
8
|
Rated Current-Max |
0.3 A
|
0.3 A
|
Self Resonance Frequency |
3600 MHz
|
3600 MHz
|
Shape/Size Description |
RECTANGULAR PACKAGE
|
|
Shielded |
NO
|
|
Surface Mount |
YES
|
|
Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Terminal Placement |
DUAL ENDED
|
|
Terminal Shape |
WRAPAROUND
|
|
Test Frequency |
100 MHz
|
|
Tolerance |
5%
|
5%
|
Base Number Matches |
2
|
2
|
Manufacturer Series |
|
CIH
|
Series |
|
CIH
|
|
|
|
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