CIH05T1N0SAE
vs
MHL1ECTTP1N0S
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
KOA SPEER ELECTRONICS INC
|
| Package Description |
0402
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| Case/Size Code |
0402
|
0402
|
| Construction |
Chip
|
Rectangular
|
| Core Material |
Ceramic
|
CERAMIC
|
| DC Resistance |
0.12 Ω
|
0.12 Ω
|
| Inductance-Nom (L) |
0.001 µH
|
0.001 µH
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| Manufacturer Series |
CIH
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
1 mm
|
1 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.5 mm
|
0.5 mm
|
| Packing Method |
Tape, Embossed
|
TR, Paper, 7 Inch
|
| Quality Factor-Min (at L-nom) |
8
|
8
|
| Rated Current-Max |
0.3 A
|
0.3 A
|
| Self Resonance Frequency |
10000 MHz
|
10000 MHz
|
| Series |
CIH
|
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8504.50.80.00
|
| Inductor Application |
|
RF INDUCTOR
|
| JESD-609 Code |
|
e3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
2
|
| Shape/Size Description |
|
RECTANGULAR PACKAGE
|
| Shielded |
|
NO
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Placement |
|
DUAL ENDED
|
| Terminal Shape |
|
WRAPAROUND
|
| Tolerance |
|
30%
|
|
|
|
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