CHV2010AFX-1005ELF
vs
CRHV2010AF10M0FKSB
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
BOURNS INC
|
VISHAY INTERTECHNOLOGY INC
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
14 Weeks
|
18 Weeks
|
| Samacsys Manufacturer |
Bourns
|
Vishay
|
| Additional Feature |
IEC60065; UL1676
|
|
| Construction |
Rectangular
|
Rectangular
|
| JESD-609 Code |
e3
|
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.6 mm
|
0.635 mm
|
| Package Length |
5 mm
|
5.08 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.5 mm
|
2.54 mm
|
| Packing Method |
TR, Paper, 7 Inch
|
BULK
|
| Rated Power Dissipation (P) |
0.5 W
|
0.5 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Reference Standard |
AEC-Q200; IEC60950
|
|
| Resistance |
10000000 Ω
|
10000000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2010
|
2010
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
TIN LEAD SILVER OVER NICKEL
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
2000 V
|
2000 V
|
| Base Number Matches |
1
|
1
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
|
|
|
Compare CHV2010AFX-1005ELF with alternatives
Compare CRHV2010AF10M0FKSB with alternatives