CHV2010-JW-136ELF
vs
HV732HTBK136J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
BOURNS INC
KOA SPEER ELECTRONICS INC
Package Description
CHIP
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Construction
Rectangular
Rectangular
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
5 mm
5 mm
Package Style
SMT
SMT
Package Width
2.5 mm
2.5 mm
Packing Method
TR, PLASTIC, 7 INCH
BULK
Rated Power Dissipation (P)
0.5 W
0.5 W
Rated Temperature
70 °C
70 °C
Resistance
13000000 Ω
13000000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
2000 V
2000 V
Base Number Matches
1
1
Pbfree Code
Package Shape
RECTANGULAR PACKAGE
Reference Standard
IEC60115-8
Compare CHV2010-JW-136ELF with alternatives
Compare HV732HTBK136J with alternatives