CHUMH4GP vs PUMH9,165 feature comparison

CHUMH4GP CHENMKO Enterprise Co Ltd

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PUMH9,165 NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer CHENMKO ENTERPRISE CO LTD NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G6 PLASTIC, SC-88, 6 PIN
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Additional Feature BUILT IN BIAS RESISTOR IS 10K BUILT-IN BIAS RESISTOR RATIO IS 4.7
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 50 V 50 V
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE) 100 100
JESD-30 Code R-PDSO-G6 R-PDSO-G6
Number of Elements 2 2
Number of Terminals 6 6
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 0.2 W 0.2 W
Reference Standard IEC-60134
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 250 MHz
Base Number Matches 1 2
Rohs Code Yes
Part Package Code TSSOP
Pin Count 6
Manufacturer Package Code SOT363
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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