CHUMH4GP
vs
PUMH9,165
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
CHENMKO ENTERPRISE CO LTD
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PDSO-G6
PLASTIC, SC-88, 6 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Additional Feature
BUILT IN BIAS RESISTOR IS 10K
BUILT-IN BIAS RESISTOR RATIO IS 4.7
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
50 V
50 V
Configuration
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE)
100
100
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
Number of Elements
2
2
Number of Terminals
6
6
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
0.2 W
0.2 W
Reference Standard
IEC-60134
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
250 MHz
Base Number Matches
1
2
Rohs Code
Yes
Part Package Code
TSSOP
Pin Count
6
Manufacturer Package Code
SOT363
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
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