CHP1/8-2R0FI
vs
CHP1/81002R00FLF
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WELWYN COMPONENTS LTD
|
TT ELECTRONICS PLC
|
Package Description |
MELF, 1206
|
MELF, ROHS COMPLIANT
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8533.21.00.30
|
8533.21.00.30
|
Construction |
Cylindrical
|
Cylindrical
|
JESD-609 Code |
e1
|
e1
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Diameter |
1.45 mm
|
1.45 mm
|
Package Length |
3.25 mm
|
3.25 mm
|
Package Shape |
CYLINDRICAL PACKAGE
|
CYLINDRICAL PACKAGE
|
Package Style |
MELF
|
MELF
|
Packing Method |
TR, 7 INCH
|
TR, 7 INCH
|
Rated Power Dissipation (P) |
0.25 W
|
0.25 W
|
Rated Temperature |
70 °C
|
70 °C
|
Reference Standard |
AEC-Q200
|
AEC-Q200
|
Resistance |
2 Ω
|
2 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
1206
|
1206
|
Surface Mount |
YES
|
YES
|
Technology |
THICK FILM/METAL GLAZE
|
THICK FILM/METAL GLAZE
|
Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu) - hot dipped
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Tolerance |
1%
|
1%
|
Working Voltage |
200 V
|
200 V
|
Base Number Matches |
1
|
1
|
|
|
|