CH891C226KG30A0
vs
SMP4B220KBNMT00
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
AVX CORP
|
API TECHNOLOGIES CORP
|
| Package Description |
,
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Capacitance |
22 µF
|
22 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| JESD-609 Code |
e0
|
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Multilayer |
Yes
|
No
|
| Negative Tolerance |
10%
|
10%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Package Style |
DIP
|
|
| Positive Tolerance |
10%
|
10%
|
| Rated (DC) Voltage (URdc) |
100 V
|
100 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Characteristics Code |
X7R
|
X7R
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Shape |
FLAT
|
FLAT
|
| Base Number Matches |
1
|
1
|
| Packing Method |
|
TR
|
| Reference Standard |
|
MIL-PRF-49470
|
|
|
|
Compare CH891C226KG30A0 with alternatives
Compare SMP4B220KBNMT00 with alternatives