CH827A-25-VIAL
vs
CH827-25-WAFFLE
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
X-XUUC-N
X-XUUC-N
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
X-XUUC-N
X-XUUC-N
JESD-609 Code
e0
e0
Number of Elements
1
1
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.25 W
0.25 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Voltage Temp Coeff-Max
0.062 mV/°C
0.062 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
7.5 mA
7.5 mA
Base Number Matches
1
1
Compare CH827A-25-VIAL with alternatives
Compare CH827-25-WAFFLE with alternatives