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CH827-37-WAFFLE vs RCH829-VIAL feature comparison

CH827-37-WAFFLE Microsemi Corporation

Buy Now Datasheet

RCH829-VIAL Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description X-XUUC-N X-XUUC-N
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code X-XUUC-N X-XUUC-N
JESD-609 Code e0 e0
Number of Elements 1 1
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape UNSPECIFIED UNSPECIFIED
Package Style UNCASED CHIP UNCASED CHIP
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.25 W 0.25 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.2 V 6.2 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Voltage Temp Coeff-Max 0.062 mV/°C 0.031 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 7.5 mA 7.5 mA
Base Number Matches 1 1
Diodes » Zener Diodes
Diodes » Zener Diodes

Compare CH827-37-WAFFLE with alternatives

Compare RCH829-VIAL with alternatives