CH825-25-VIAL
vs
CH827-25-WAFFLE
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Package Description |
X-XUUC-N
|
X-XUUC-N
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
X-XUUC-N
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Power Dissipation-Max |
0.25 W
|
0.25 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
6.2 V
|
6.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Voltage Temp Coeff-Max |
0.124 mV/°C
|
0.062 mV/°C
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
7.5 mA
|
7.5 mA
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CH825-25-VIAL with alternatives
Compare CH827-25-WAFFLE with alternatives