CH5913-37E3 vs MQHSMBJ5913E3 feature comparison

CH5913-37E3 Microsemi Corporation

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MQHSMBJ5913E3 Microsemi Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description R-XUUC-N1 ROHS COMPLIANT, PLASTIC PACKAGE-2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code R-XUUC-N1 R-PDSO-C2
Number of Elements 1 1
Number of Terminals 1 2
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.56 W
Reference Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form NO LEAD C BEND
Terminal Position UPPER DUAL
Voltage Tol-Max 20% 20%
Working Test Current 113.6 mA 113.6 mA
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DO-214AA
Pin Count 2
JEDEC-95 Code DO-214AA
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Qualification Status Not Qualified
Terminal Finish MATTE TIN

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