CH5381BE3 vs MXSMBG5381BE3 feature comparison

CH5381BE3 Microsemi Corporation

Buy Now Datasheet

MXSMBG5381BE3 Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description R-XUUC-N1 R-PDSO-G2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code R-XUUC-N1 R-PDSO-G2
Number of Elements 1 1
Number of Terminals 1 2
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 5 W 1.38 W
Reference Voltage-Nom 130 V 130 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Voltage Tol-Max 5% 5%
Working Test Current 10 mA 10 mA
Base Number Matches 1 2
Rohs Code Yes
Part Package Code DO-215AA
Pin Count 2
Additional Feature HIGH SURGE CURRENT CAPABILITY
JEDEC-95 Code DO-215AA
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Qualification Status Not Qualified
Reference Standard MIL-19500
Terminal Finish MATTE TIN

Compare CH5381BE3 with alternatives

Compare MXSMBG5381BE3 with alternatives