CH3040B-37 vs MQ1N4760URE3 feature comparison

CH3040B-37 Microsemi Corporation

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MQ1N4760URE3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description R-XUUC-N1 O-LELF-R2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code R-XUUC-N1 O-LELF-R2
JESD-609 Code e0 e3
Knee Impedance-Max 2000 Ω
Number of Elements 1 1
Number of Terminals 1 2
Package Body Material UNSPECIFIED GLASS
Package Shape RECTANGULAR ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 68 V 68 V
Reverse Current-Max 10 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form NO LEAD WRAP AROUND
Terminal Position UPPER END
Voltage Temp Coeff-Max 61.2 mV/°C
Voltage Tol-Max 5% 10%
Working Test Current 3.7 mA 3.7 mA
Base Number Matches 2 2
Part Package Code DO-213AB
Pin Count 2
Additional Feature HIGH RELIABILITY
Case Connection ISOLATED
JEDEC-95 Code DO-213AB
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Reference Standard MIL-19500

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