CH3038B-37 vs 2EZ56D5E3 feature comparison

CH3038B-37 Microsemi Corporation

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2EZ56D5E3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description R-XUUC-N1 O-PALF-W2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code R-XUUC-N1 O-PALF-W2
JESD-609 Code e0 e3
Knee Impedance-Max 2000 Ω
Number of Elements 1 1
Number of Terminals 1 2
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1.19 W
Qualification Status Not Qualified
Reference Voltage-Nom 56 V 56 V
Reverse Current-Max 10 µA
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form NO LEAD WIRE
Terminal Position UPPER AXIAL
Voltage Temp Coeff-Max 50.4 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 4.5 mA 9 mA
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code DO-41
Pin Count 2
Case Connection ISOLATED
JEDEC-95 Code DO-204AL
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C

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