CH3017A-37E3
vs
JAN1N3017BUR-1
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
R-XUUC-N1
|
DO-213AB, 2 PIN
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
R-XUUC-N1
|
O-LELF-R2
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
2
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
1 W
|
1 W
|
Reference Voltage-Nom |
7.5 V
|
7.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
NO LEAD
|
WRAP AROUND
|
Terminal Position |
UPPER
|
END
|
Voltage Tol-Max |
10%
|
5%
|
Working Test Current |
34 mA
|
34 mA
|
Base Number Matches |
1
|
8
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
DO-213AB
|
Pin Count |
|
2
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Case Connection |
|
ISOLATED
|
JEDEC-95 Code |
|
DO-213AB
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
1
|
Qualification Status |
|
Not Qualified
|
Reference Standard |
|
MIL-19500/115K
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare CH3017A-37E3 with alternatives
Compare JAN1N3017BUR-1 with alternatives