CH3017-37
vs
MX1N3017UR-1TR
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
R-XUUC-N1
O-LELF-R2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
R-XUUC-N1
O-LELF-R2
JESD-609 Code
e0
e0
Knee Impedance-Max
700 Ω
Number of Elements
1
1
Number of Terminals
1
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
RECTANGULAR
ROUND
Package Style
UNCASED CHIP
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1.25 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
7.5 V
7.5 V
Reverse Current-Max
100 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
WRAP AROUND
Terminal Position
UPPER
END
Voltage Temp Coeff-Max
3.375 mV/°C
Voltage Tol-Max
20%
20%
Working Test Current
34 mA
34 mA
Base Number Matches
1
1
Part Package Code
DO-213AB
Pin Count
2
Additional Feature
METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection
ISOLATED
JEDEC-95 Code
DO-213AB
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare CH3017-37 with alternatives
Compare MX1N3017UR-1TR with alternatives