CH3017-37 vs MX1N3017UR-1TR feature comparison

CH3017-37 Microsemi Corporation

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MX1N3017UR-1TR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description R-XUUC-N1 O-LELF-R2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code R-XUUC-N1 O-LELF-R2
JESD-609 Code e0 e0
Knee Impedance-Max 700 Ω
Number of Elements 1 1
Number of Terminals 1 2
Package Body Material UNSPECIFIED GLASS
Package Shape RECTANGULAR ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1.25 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 7.5 V 7.5 V
Reverse Current-Max 100 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD WRAP AROUND
Terminal Position UPPER END
Voltage Temp Coeff-Max 3.375 mV/°C
Voltage Tol-Max 20% 20%
Working Test Current 34 mA 34 mA
Base Number Matches 1 1
Part Package Code DO-213AB
Pin Count 2
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED
JEDEC-95 Code DO-213AB
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C

Compare CH3017-37 with alternatives

Compare MX1N3017UR-1TR with alternatives