CH1N5313
vs
MV1N5313
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DIE
Package Description
DIE-1
Pin Count
1
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.40
8541.10.00.70
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JESD-30 Code
S-XUUC-N1
O-LALF-W2
JESD-609 Code
e3
e0
Knee Impedance-Max
14000 Ω
14000 Ω
Limiting Voltage-Max
2.75 V
2.75 V
Number of Elements
1
1
Number of Terminals
1
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Power Dissipation-Max
0.475 W
0.475 W
Qualification Status
Not Qualified
Not Qualified
Regulation Current-Nom (Ireg)
4.3 mA
4.3 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
YES
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
AXIAL
Base Number Matches
1
1
Case Connection
ISOLATED
JEDEC-95 Code
DO-7
Compare CH1N5313 with alternatives
Compare MV1N5313 with alternatives