CH1N5303
vs
1N5303
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
COMPENSATED DEVICES INC
Part Package Code
DIE
Package Description
DIE-1
Pin Count
1
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.40
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JESD-30 Code
S-XUUC-N1
O-LALF-W2
JESD-609 Code
e3
e0
Knee Impedance-Max
92000 Ω
92000 Ω
Limiting Voltage-Max
1.65 V
1.65 V
Number of Elements
1
1
Number of Terminals
1
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-55 °C
-65 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Power Dissipation-Max
0.475 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Regulation Current-Nom (Ireg)
1.6 mA
1.6 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
YES
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
AXIAL
Base Number Matches
1
24
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
JEDEC-95 Code
DO-7
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