CH1N5294
vs
JANTX1N5294UR-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DIE
Package Description
DIE-1
HERMETIC SEALED, GLASS, LL41, MELF-2
Pin Count
1
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.40
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JESD-30 Code
S-XUUC-N1
O-LELF-R2
JESD-609 Code
e3
e0
Knee Impedance-Max
335000 Ω
Limiting Voltage-Max
1.2 V
1.2 V
Number of Elements
1
1
Number of Terminals
1
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-55 °C
-65 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Power Dissipation-Max
0.475 W
0.5 W
Qualification Status
Not Qualified
Qualified
Regulation Current-Nom (Ireg)
0.75 mA
0.75 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
YES
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN
TIN LEAD
Terminal Form
NO LEAD
WRAP AROUND
Terminal Position
UPPER
END
Base Number Matches
1
1
Factory Lead Time
21 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
JEDEC-95 Code
DO-213AB
Moisture Sensitivity Level
1
Reference Standard
MIL-19500
Compare CH1N5294 with alternatives
Compare JANTX1N5294UR-1 with alternatives