CH1N5294
vs
1N5294
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
VPT COMPONENTS
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE-1
|
GLASS PACKAGE-2
|
| Pin Count |
1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.40
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| JESD-30 Code |
S-XUUC-N1
|
O-LALF-W2
|
| JESD-609 Code |
e3
|
e0
|
| Knee Impedance-Max |
335000 Ω
|
|
| Limiting Voltage-Max |
1.2 V
|
1.2 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
SQUARE
|
ROUND
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Power Dissipation-Max |
0.475 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulation Current-Nom (Ireg) |
0.75 mA
|
0.75 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UPPER
|
AXIAL
|
| Base Number Matches |
1
|
11
|
| Case Connection |
|
ISOLATED
|
| JEDEC-95 Code |
|
DO-7
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Reference Standard |
|
MIL-19500/463
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare CH1N5294 with alternatives
Compare 1N5294 with alternatives