CGA6P3X7R1E226M250AE
vs
MBAST32MSB7226MPNA01
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TDK CORP
|
TAIYO YUDEN CO LTD
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.24.00.20
|
8532.24.00.20
|
| Factory Lead Time |
32 Weeks, 4 Days
|
|
| Samacsys Manufacturer |
TDK
|
TAIYO YUDEN
|
| Capacitance |
22 µF
|
22 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
2.5 mm
|
2.5 mm
|
| JESD-609 Code |
e3
|
|
| Length |
3.2 mm
|
3.2 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
TR, 7 INCH
|
TR, Embossed, 7 Inch
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
25 V
|
25 V
|
| Reference Standard |
AEC-Q200
|
|
| Size Code |
1210
|
1210
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
X7R
|
X7R
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
MATTE TIN OVER NICKEL
|
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Width |
2.5 mm
|
2.5 mm
|
| Base Number Matches |
1
|
1
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
|
|
|
Compare CGA6P3X7R1E226M250AE with alternatives
Compare MBAST32MSB7226MPNA01 with alternatives