CGA2B3X7R1H104K050BB vs CGA2B3X7R1H104K050BD feature comparison

CGA2B3X7R1H104K050BB TDK Corporation

Buy Now Datasheet

CGA2B3X7R1H104K050BD TDK Corporation

Buy Now Datasheet
Yes Yes
Yes Yes
Active Active
TDK CORP TDK CORP
CHIP CHIP
compliant compliant
EAR99 EAR99
8532.24.00.20 8532.24.00.20
TDK TDK
0.1 µF 0.1 µF
CERAMIC CAPACITOR CERAMIC CAPACITOR
CERAMIC CERAMIC
0.5 mm 0.5 mm
e3 e3
1 mm 1 mm
SURFACE MOUNT SURFACE MOUNT
Yes Yes
10% 10%
2 2
125 °C 125 °C
-55 °C -55 °C
RECTANGULAR PACKAGE RECTANGULAR PACKAGE
SMT SMT
TR, 7 INCH TR, 7 INCH
10% 10%
50 V 50 V
AEC-Q200 AEC-Q200
0402 0402
YES YES
X7R X7R
15% ppm/°C 15% ppm/°C
Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
WRAPAROUND WRAPAROUND
0.5 mm 0.5 mm
1 1
16 Weeks, 4 Days

Compare CGA2B3X7R1H104K050BB with alternatives

Compare CGA2B3X7R1H104K050BD with alternatives