CFA1170C
vs
DM3725CUS
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
LSI CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
,
|
0.65 MM PITCH, GREEN, PLASTIC, FCBGA-423
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
26
|
| Boundary Scan |
NO
|
YES
|
| External Data Bus Width |
5
|
16
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
YES
|
| Low Power Mode |
NO
|
YES
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
423
|
| ECCN Code |
|
5A992.C
|
| Bit Size |
|
32
|
| Clock Frequency-Max |
|
54 MHz
|
| JESD-30 Code |
|
S-PBGA-B423
|
| JESD-609 Code |
|
e1
|
| Length |
|
16 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of DMA Channels |
|
128
|
| Number of Terminals |
|
423
|
| Operating Temperature-Max |
|
90 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Equivalence Code |
|
BGA423,24X24,25
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| RAM (words) |
|
16384
|
| Seated Height-Max |
|
1.4 mm
|
| Speed |
|
800 MHz
|
| Supply Current-Max |
|
1400 mA
|
| Supply Voltage-Max |
|
1.2 V
|
| Supply Voltage-Min |
|
1.08 V
|
| Supply Voltage-Nom |
|
1.14 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
16 mm
|
|
|
|
Compare CFA1170C with alternatives
Compare DM3725CUS with alternatives