CE28C010H-250 vs X28C010J-25 feature comparison

CE28C010H-250 LSI Corporation

Buy Now Datasheet

X28C010J-25 Xicor Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SEEQ TECHNOLOGY INC XICOR INC
Package Description DIP, DIP32,.6 PLASTIC, LCC-32
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 250 ns 250 ns
Additional Feature AUTOMATIC WRITE;PAGE WRITE;BULK ERASE PAGE WRITE
Command User Interface NO NO
Data Polling YES YES
Endurance 10000 Write/Erase Cycles
JESD-30 Code R-CDIP-T32 R-PQCC-J32
JESD-609 Code e0 e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP32,.6 LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Page Size 128 words 256 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.00085 A 0.0005 A
Supply Current-Max 0.12 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Toggle Bit YES YES
Write Cycle Time-Max (tWC) 5 ms 10 ms
Base Number Matches 1 2
Length 13.97 mm
Seated Height-Max 3.56 mm
Width 11.43 mm

Compare CE28C010H-250 with alternatives

Compare X28C010J-25 with alternatives