CDR33BX473AKURAP vs CDR33BX473AKZPAC feature comparison

CDR33BX473AKURAP Vishay Intertechnologies

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CDR33BX473AKZPAC Vishay Intertechnologies

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer VISHAY INTERTECHNOLOGY INC VISHAY INTERTECHNOLOGY INC
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Factory Lead Time 18 Weeks 18 Weeks
Capacitance 0.047 µF 0.047 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.5 mm 1.5 mm
JESD-609 Code e0 e0
Length 3.2 mm 3.2 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, PUNCHED PAPER, 11.25/13 INCH TR, PUNCHED PAPER, 7 INCH
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 50 V 50 V
Reference Standard MIL-PRF-55681 MIL-PRF-55681
Size Code 1210 1210
Surface Mount YES YES
Temperature Characteristics Code BX BX
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Width 2.5 mm 2.5 mm
Base Number Matches 1 1

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