CDR33BX473AKUPAP
vs
CDR33BX473AKYPAJ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
VISHAY INTERTECHNOLOGY INC
VISHAY INTERTECHNOLOGY INC
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Factory Lead Time
18 Weeks
18 Weeks
Capacitance
0.047 µF
0.047 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
1.5 mm
1.5 mm
JESD-609 Code
e0
e3
Length
3.2 mm
3.2 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
10%
10%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
TR, PUNCHED PAPER, 11.25/13 INCH
TR, EMBOSSED PLASTIC, 7 INCH
Positive Tolerance
10%
10%
Rated (DC) Voltage (URdc)
50 V
50 V
Reference Standard
MIL-PRF-55681
MIL-PRF-55681/9
Size Code
1210
1210
Surface Mount
YES
YES
Temperature Characteristics Code
BX
BX
Temperature Coefficient
15% ppm/°C
15% ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
2.5 mm
2.5 mm
Base Number Matches
2
2
Compare CDR33BX473AKUPAP with alternatives
Compare CDR33BX473AKYPAJ with alternatives