CDR33BP102BFYSAB
vs
CDR33BP102BFMPAT
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
VISHAY INTERTECHNOLOGY INC
VISHAY INTERTECHNOLOGY INC
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Factory Lead Time
18 Weeks
18 Weeks
Capacitance
0.001 µF
0.001 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
1.5 mm
1.5 mm
JESD-609 Code
e3
e4
Length
3.2 mm
3.2 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
1%
1%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
BULK
TR, EMBOSSED PLASTIC, 7 INCH
Positive Tolerance
1%
1%
Rated (DC) Voltage (URdc)
100 V
100 V
Reference Standard
MIL-PRF-55681/9
MIL-PRF-55681/9
Size Code
1210
1210
Surface Mount
YES
YES
Temperature Characteristics Code
BP
BP
Temperature Coefficient
30ppm/Cel ppm/°C
30ppm/Cel ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Silver/Palladium (Ag/Pd)
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
2.5 mm
2.5 mm
Base Number Matches
2
2
Compare CDR33BP102BFYSAB with alternatives
Compare CDR33BP102BFMPAT with alternatives