CDR32BP751BFZSAC
vs
CDR32BP751BFWP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
VISHAY INTERTECHNOLOGY INC
KEMET ELECTRONICS CORP
Package Description
CHIP
, 1206
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Factory Lead Time
18 Weeks
Category CO2 Kg
3.59
Compliance Temperature Grade
Military: -55C to +125C
Candidate List Date
2018-01-15
EFUP
50
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.31
Capacitance
0.00075 µF
0.00075 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
1.3 mm
1.3 mm
JESD-609 Code
e0
e0
Length
3.2 mm
3.2 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
1%
1%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
TR, PUNCHED PAPER, 7 INCH
TR, 7 INCH
Positive Tolerance
1%
1%
Rated (DC) Voltage (URdc)
100 V
100 V
Reference Standard
MIL-PRF-55681/8
MIL-PRF-55681
Size Code
1206
1206
Surface Mount
YES
YES
Temperature Characteristics Code
BP
BP
Temperature Coefficient
30ppm/Cel ppm/°C
30ppm/Cel ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
TIN LEAD OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
1.6 mm
1.6 mm
Base Number Matches
1
1
Pbfree Code
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