CDR32BP331BKWPAC
vs
CDR32BP331BKZPAR
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
VISHAY INTERTECHNOLOGY INC
VISHAY INTERTECHNOLOGY INC
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Factory Lead Time
18 Weeks
18 Weeks
Capacitance
0.00033 µF
0.00033 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
1.3 mm
1.3 mm
JESD-609 Code
e0
e0
Length
3.2 mm
3.2 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
10%
10%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
TR, PUNCHED PAPER, 7 INCH
TR, EMBOSSED PLASTIC, 11.25/13 INCH
Positive Tolerance
10%
10%
Rated (DC) Voltage (URdc)
100 V
100 V
Reference Standard
MIL-PRF-55681/8
MIL-PRF-55681/8
Size Code
1206
1206
Surface Mount
YES
YES
Temperature Characteristics Code
BP
BP
Temperature Coefficient
30ppm/Cel ppm/°C
30ppm/Cel ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
1.6 mm
1.6 mm
Base Number Matches
2
2
Compare CDR32BP331BKWPAC with alternatives
Compare CDR32BP331BKZPAR with alternatives