CDR32BP101BFMMAB
vs
CDR32BP101BFUP
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
VISHAY INTERTECHNOLOGY INC
AVX CORP
Package Description
CHIP
, 1206
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.23.00.20
Capacitance
0.0001 µF
0.0001 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
1.3 mm
1.3 mm
JESD-609 Code
e4
e0
Length
3.2 mm
3.2 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
No
Negative Tolerance
1%
1%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
BULK
BULK
Positive Tolerance
1%
1%
Rated (DC) Voltage (URdc)
100 V
100 V
Reference Standard
MIL-PRF-55681/8
Size Code
1206
1206
Surface Mount
YES
YES
Temperature Characteristics Code
BP
BP
Temperature Coefficient
30ppm/Cel ppm/°C
30ppm/Cel ppm/°C
Terminal Finish
Silver/Palladium (Ag/Pd)
TIN LEAD OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
1.6 mm
1.6 mm
Base Number Matches
2
3
Pbfree Code
No
Factory Lead Time
28 Weeks
Additional Feature
MIL-PRF-55681
Compare CDR32BP101BFMMAB with alternatives
Compare CDR32BP101BFUP with alternatives